Clearfil Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers, that forms a thin, strong adhesive layer with no waiting time, resulting in Advanced Rapid Bond Technology. This combination improves the strength of the bonding layer, aimed at gaining reliability for one-step bonding and no refrigeration required for storage.
- Simple and predictable
- Quick application and no waiting time
- Lower film thickness
- Stronger bond layer
- Uniform bond layer that doesn't pool
- Room Temperature storage
