- Ease of use. Gel-phase cleanup, no refrigeration, no hand mixing or trituration required
- High bond strength without an adhesive and high mechanical strength
- Low solubility for reliable cementation
- Compatibility with common materials. Ceramic and Zirconia incl. CAD/CAM materials, PFMs and metal restorations
- Efficient self-cure mode sets up completely without any light
- Low 10 μ film thickness cuts down on adjustment time
- Radiopaque for excellent identification under x-ray
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